National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Semiautomatic Dispenser Application in Flexible Low Series PCB Assembly in SMT
Prikryl, Petr ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this thesis is solving the issue of introducing the Dotmaster semi-automatic dispenser into the flexible low series surface mount technology assembly of printed circuit boards. The first part of the thesis deals with the issue of introduction to the dispension of solderpastes, adhesives and packaging materials. The second part is focused on the description of the Dotmaster semi-autamatic. The last part is devoted to actual measuring and observation with the device using PD 860002 SA adhesive made by Heraeus company and SAC solder paste by Kester company. Showing the characteristics of dependecies of the shape of the dispensed adhesive and solder paste on several parameters of dispension follows.
Semiautomatic Dispenser Application in Flexible Low Series PCB Assembly in SMT
Prikryl, Petr ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this thesis is solving the issue of introducing the Dotmaster semi-automatic dispenser into the flexible low series surface mount technology assembly of printed circuit boards. The first part of the thesis deals with the issue of introduction to the dispension of solderpastes, adhesives and packaging materials. The second part is focused on the description of the Dotmaster semi-autamatic. The last part is devoted to actual measuring and observation with the device using PD 860002 SA adhesive made by Heraeus company and SAC solder paste by Kester company. Showing the characteristics of dependecies of the shape of the dispensed adhesive and solder paste on several parameters of dispension follows.

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